型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4X51163PC-LGC3 | SAMSUNG/三星 | BGA | 19+ | 3000 | 2025-05-27 | |||
JS29F16B08CCME2 | INTEL/英特尔 | TSOP48 | 14+ | 3000 | 2025-05-27 | |||
H5TQ4G83MFR-PBC | SKHYNIX/海力士 | FBGA78 | 14+ | 3000 | 2025-05-27 | |||
K9F1G08UOE-SIBO |
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SAMSUNG/三星 | TSOP48 | 17+ | 5000 | 2025-05-27 | ||
K9F1G08UOD-SCBO |
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SAMSUNG/三星 | TSOP48 | 14+ | 5000 | 2025-05-27 | ||
K9F1G08UOC-PCBO |
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SAMSUNG/三星 | TSOP48 | 12+ | 5000 | 2025-05-27 | ||
K9F1G08U0D-SCB0 |
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SAMSUNG/三星 | TSOP48 | 14+ | 5000 | 2025-05-27 | ||
K6R4016C1D-UI10 | SAMSUNG/三星 | TSOP44 | 10+ | 2200 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4UBE3D4AA-MGCL | SAMSUNG/三星 | BGA200 | 23+ | 1000 | 2025-05-27 | |||
K4F6E304HB-MGCJ | SAMSUNG/三星 | BGA200 | 19+ | 1000 | 2025-05-27 | |||
K4E6E304ED-EGCG | SAMSUNG/三星 | BGA178 | 23+ | 1000 | 2025-05-27 | |||
K4E6E304EB-EGCF | SAMSUNG/三星 | BGA178 | 20+ | 1000 | 2025-05-27 | |||
K4F8E3S4HB-MFCJ | SAMSUNG/三星 | BGA200 | 20+ | 1000 | 2025-05-27 | |||
K4E8E324ED-EGCG | SAMSUNG/三星 | BGA178 | 22+ | 1000 | 2025-05-27 | |||
K4E8E304EE-EGCE | SAMSUNG/三星 | BGA178 | 16+ | 1000 | 2025-05-27 | |||
K4E8E324EB-EGCF | SAMSUNG/三星 | BGA178 | 19+ | 1000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
H57V2562GTR-75C |
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SKHYNIX/海力士 | TSOP54 | 12+ | 3000 | 2025-05-27 | ||
H27UBG8T2BTR-BC |
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SKHYNIX/海力士 | TSOP48 | 14+ | 3000 | 2025-05-27 | ||
H26M31003GMR | SKHYNIX/海力士 | BGA153 | 14+ | 1835 | 2025-05-27 | |||
AT49BV162A-70TI | ATMEL/爱特梅尔 | TSOP48 | 12+ | 5000 | 2025-05-27 | |||
IS42S16320B-6TL | ISSI/芯成 | TSOP54 | 13+ | 3000 | 2025-05-27 | |||
IS61LV5128AL-10TLI |
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ISSI/芯成 | TSOP44 | 23+ | 3000 | 2025-05-27 | ||
JS29F16B08CCME2 | INTEL/英特尔 | TSOP48 | 14+ | 3000 | 2025-05-27 | |||
K9F1G08UOE-SIBO |
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SAMSUNG/三星 | TSOP48 | 17+ | 5000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
HY27US08121B-TPCB | SKHYNIX/海力士 | TSOP48 | 19+ | 5000 | 2025-05-27 | |||
H5TQ1G63EFR-H9C | SKHYNIX/海力士 | FBGA96 | 16+ | 3000 | 2025-05-27 | |||
H5PS5162FFR-Y5C | SKHYNIX/海力士 | FBGA84 | 11+ | 3000 | 2025-05-27 | |||
H5PS5162FFR-S6C | SKHYNIX/海力士 | BGA | 13+ | 3000 | 2025-05-27 | |||
H57V1262GTR-75C | SKHYNIX/海力士 | TSOP54 | 13+ | 3000 | 2025-05-27 | |||
H27UCG8T2ATR-BC | SKHYNIX/海力士 | TSOP | 14+ | 3000 | 2025-05-27 | |||
H27U518S2CTR-BC |
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SKHYNIX/海力士 | TSOP48 | 14+ | 3000 | 2025-05-27 | ||
H27U2G8F2CTR-BI | SKHYNIX/海力士 | TSOP48 | 17+ | 10 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F1G08UOC-PCBO |
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SAMSUNG/三星 | TSOP48 | 12+ | 5000 | 2025-05-27 | ||
K9F1208UOC-PCBO |
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SAMSUNG/三星 | TSOP48 | 12+ | 5000 | 2025-05-27 | ||
MT29F2G08ABAEAH4-IT:E | MICRON/美光 | BGA63 | 17+ | 3000 | 2025-05-27 | |||
MT29F64G08CBABAWP:B | MICRON/美光 | TSOP48 | 17+ | 7000 | 2025-05-27 | |||
MTFC8GAKAJCN-4M IT | MICRON/美光 | BGA153 | 22+ | 3000 | 2025-05-27 | |||
S29GL128P10TFI010 | SPANSION/飞索半导体 | TSOP56 | 23+ | 3000 | 2025-05-27 | |||
KLM4G1FETE-B041 | SAMSUNG/三星 | BGA | 23+ | 3000 | 2025-05-27 | |||
KLM8G1GETF-B041 | SAMSUNG/三星 | BGA | 23+ | 5000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
H5TQ4G83MFR-PBC | SKHYNIX/海力士 | FBGA78 | 14+ | 3000 | 2025-05-27 | |||
K9G8G08UOA-PCBO | SAMSUNG/三星 | TSOP48 | 19+ | 3000 | 2025-05-27 | |||
SDIN8DE2-16G-XI | SANDISK/闪迪 | BGA153 | 18+ | 10 | 2025-05-27 | |||
SDINBDG4-64G | SANDISK/闪迪 | BGA153 | 19+ | 3000 | 2025-05-27 | |||
K9GAG08U0E-SCB0 |
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SAMSUNG/三星 | TSOP48 | 12+ | 5000 | 2025-05-27 | ||
MT47H128M16RT-25EIT:C | MICRON/美光 | BGA | 19+ | 3000 | 2025-05-27 | |||
NAND08GW3B2CN6E | ST/意法 | TSOP48 | 09+ | 3000 | 2025-05-27 | |||
NAND01GW3B2BN6E | ST/意法 | TSOP48 | 14+ | 3000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F1G08UOD-SCBO |
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SAMSUNG/三星 | TSOP48 | 14+ | 5000 | 2025-05-27 | ||
K4T1G164QG-BCF7 | SAMSUNG/三星 | FBGA84 | 14+ | 5000 | 2025-05-27 | |||
THGBMJG6C1LBAIL | TOSHIBA/东芝 | BGA153 | 23+ | 3000 | 2025-05-27 | |||
S29JL032J70TFI01 | SPANSION/飞索半导体 | TSOP48 | 23+ | 3000 | 2025-05-27 | |||
S29GL512N11FFA02 | SPANSION/飞索半导体 | BGA64 | 13+ | 3000 | 2025-05-27 | |||
W971GG6JB-25 |
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WINBOND/华邦 | FBGA84 | 14+ | 3000 | 2025-05-27 | ||
TC58NVG0S3ETA00 | TOSHIBA/东芝 | TSOP48 | 16+ | 3000 | 2025-05-27 | |||
W9825G6EH-6 | WINBOND/华邦 | TSOP | 10+ | 3000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4F6E3S4HM-MGCJ | SAMSUNG/三星 | BGA200 | 24+ | 1000 | 2025-05-27 | |||
W631GG6MB-12 | WINBOND/华邦 | BGA96 | 19+ | 3000 | 2025-05-27 | |||
W9751G6KB-25 | WINBOND/华邦 | FBGA84 | 17+ | 3000 | 2025-05-27 | |||
W9825G6KH-6 | WINBOND/华邦 | TSOP | 20+ | 3000 | 2025-05-27 | |||
W9864G6KH-6 | WINBOND/华邦 | BGA54 | 16+ | 7 | 2025-05-27 | |||
W9825G6KH-6I | WINBOND/华邦 | TSOP54 | 20+ | 3000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
CY7C1049DV33-10ZSXI | CYPRESS/赛普拉斯 | TSOP44 | 10+ | 3000 | 2025-05-27 | |||
MT41K256M16HA-125:E | MICRON/美光 | BGA96 | 17+ | 2200 | 2025-05-27 | |||
MT41K256M16TW-107IT:P | MICRON/美光 | FBGA96 | 23+ | 3000 | 2025-05-27 | |||
MT40A512M16LY-075:E | MICRON/美光 | BGA96 | 23+ | 21 | 2025-05-27 | |||
MT47H32M16NF-25E:H | MICRON/美光 | BGA | 14+ | 3000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
HY57V281620ETP-6 | SKHYNIX/海力士 | TSOP | 14+ | 3000 | 2025-05-27 | |||
HY57V281620ETP-HI | SKHYNIX/海力士 | TSOP | 08+ | 3000 | 2025-05-27 | |||
HY57V561620FTP-HI | SKHYNIX/海力士 | TSOP | 11+ | 3000 | 2025-05-27 | |||
HY57V641620ETP-7 | SKHYNIX/海力士 | TSOP54 | 08+ | 3000 | 2025-05-27 | |||
HY57V641620ETP-H | SKHYNIX/海力士 | TSOP54 | 08+ | 3000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
H5TC4G63AFR-11C | SKHYNIX/海力士 | BGA | 14+ | 3000 | 2025-05-27 | |||
MT29F4G08ABBDAH4-AITX:D | MICRON/美光 | BGA | 16+ | 1000 | 2025-05-27 | |||
S29GL256N11FFA02 | SPANSION/飞索半导体 | BGA64 | 14+ | 3000 | 2025-05-27 | |||
K9WAG08U1D-SCBO | SAMSUNG/三星 | TSOP48 | 13+ | 5000 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F1208U0B-PCB0 |
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SAMSUNG/三星 | TSOP48 | 215+ | 105 | 2025-05-27 | ||
K9F1G08U0E-SIB0 |
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SAMSUNG/三星 | TSOP48 | 711+ | 113 | 2025-05-27 | ||
H5DU5162ETR-E3C |
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SKHYNIX/海力士 | TSOP66 | 212+ | 131 | 2025-05-27 | ||
H57V2562GTR-75C |
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SKHYNIX/海力士 | TSOP54 | 302+ | 469 | 2025-05-27 | ||
K9F1G08U0C-PCB0 |
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SAMSUNG/三星 | TSOP48 | 228+ | 212 | 2025-05-27 | ||
H26M31001HPR | SKHYNIX/海力士 | BGA153 | 818+ | 88 | 2025-05-27 | |||
H26M41204HPR | SKHYNIX/海力士 | TSOP48 | 947+ | 400 | 2025-05-27 | |||
H26M41204HPR | SKHYNIX/海力士 | BGA | 19+ | 1835 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
H26M52208FPR | SKHYNIX/海力士 | BGA153 | 648+ | 360 | 2025-05-27 | |||
K4B2G1646Q-BCK0 | SAMSUNG/三星 | FBGA96 | 710+ | 201 | 2025-05-27 | |||
H27U1G8F2BTR-BC | SKHYNIX/海力士 | TSPO48 | 713+ | 532 | 2025-05-27 | |||
IS62WV51216BLL-55TLI |
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ISSI/芯成 | TSOP44 | 2210+ | 34 | 2025-05-27 | ||
H26M52103FMR | SKHYNIX/海力士 | BGA153 | 17+ | 51 | 2025-05-27 | |||
K9F1G08U0E-SIB0 |
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SAMSUNG/三星 | TSOP48 | 711+ | 113 | 2025-05-27 | ||
H26M31001HPR | SKHYNIX/海力士 | BGA153 | 818+ | 88 | 2025-05-27 | |||
H26M41204HPR | SKHYNIX/海力士 | TSOP48 | 947+ | 400 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F2G08UOC-SIBO |
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SAMSUNG/三星 | TSOP48 | 410+ | 20 | 2025-05-27 | ||
K9F2G08U0C-SIB0 |
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SAMSUNG/三星 | TSOP48 | 410+ | 20 | 2025-05-27 | ||
K9F1208U0C-PCB0 |
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SAMSUNG/三星 | TSOP48 | 216+ | 200 | 2025-05-27 | ||
K9F4G08U0B-PCB0 |
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SAMSUNG/三星 | TSOP48 | 240+ | 600 | 2025-05-27 | ||
K9F2G08UOB-PIBO |
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SAMSUNG/三星 | TSOP48 | 238+ | 160 | 2025-05-27 | ||
H5DU5162ETR-E3C |
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SKHYNIX/海力士 | TSOP66 | 212+ | 131 | 2025-05-27 | ||
H57V2562GTR-75C |
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SKHYNIX/海力士 | TSOP54 | 302+ | 469 | 2025-05-27 | ||
K9F1G08U0C-PCB0 |
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SAMSUNG/三星 | TSOP48 | 228+ | 212 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F1208U0B-PCB0 |
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SAMSUNG/三星 | TSOP48 | 215+ | 105 | 2025-05-27 | ||
K9F1208UOB-PCBO |
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SAMSUNG/三星 | TSOP48 | 215+ | 105 | 2025-05-27 | ||
K9F2G08U0B-PIB0 |
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SAMSUNG/三星 | TSOP48 | 238+ | 160 | 2025-05-27 | ||
JS28F640J3D75 | INTEL/英特尔 | TSOP56 | 438+ | 23 | 2025-05-27 | |||
H26M21001FPR | SKHYNIX/海力士 | BGA153 | 503+ | 85 | 2025-05-27 | |||
JS28F128J3F75 | INTEL/英特尔 | TOSP56 | 726+ | 60 | 2025-05-27 | |||
K4T1G164QF-BCE7 | SAMSUNG/三星 | FBGA84 | 325+ | 274 | 2025-05-27 | |||
H27UBG8T2CTR-BC |
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SKHYNIX/海力士 | TSOP48 | 513+ | 51 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9F1208UOC-PCBO |
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SAMSUNG/三星 | TSOP48 | 216+ | 300 | 2025-05-27 | ||
MT29F1G08ABADAWP-IT:D | MICRON/美光 | TSOP48 | 1716+ | 94 | 2025-05-27 | |||
MT29F4G08ABADAWP:D | MICRON/美光 | TSOP48 | 2108+ | 98 | 2025-05-27 | |||
KLM8G1GETF-B041 | SAMSUNG/三星 | BGA153 | 20+ | 500 | 2025-05-27 | |||
KLM8G1GETF-B041 | SAMSUNG/三星 | BGA153 | 228+ | 354 | 2025-05-27 | |||
KLMAG1JETD-B041 | SAMSUNG/三星 | BGA153 | 328+ | 1000 | 2025-05-27 | |||
MT29F8G08ABACAWP-IT:C | MICRON/美光 | TSOP48 | 2120+ | 121 | 2025-05-27 | |||
MT29F4G08ABADAWP-IT:D | MICRON/美光 | TSOP48 | 2208+ | 235 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MT41K512M16HA-125:A | MICRON/美光 | BGA153 | 2108+ | 57 | 2025-05-27 | |||
W9751G6KB-25 | WINBOND/华邦 | BGA84 | 913+ | 20 | 2025-05-27 | |||
MT47H128M16RT-25E:C | MICRON/美光 | BGA84 | 2232+ | 84 | 2025-05-27 | |||
W971GG6SB-25 | WINBOND/华邦 | BGA84 | 738+ | 1698 | 2025-05-27 | |||
MT48LC16M16A2P-6A:G | MICRON/美光 | TSOP54 | 2020+ | 8 | 2025-05-27 | |||
W9825G6KH-6 | WINBOND/华邦 | TSOP54 | 2042+ | 11 | 2025-05-27 | |||
W9825G6KH-6I | WINBOND/华邦 | TSOP54 | 2019+ | 2 | 2025-05-27 | |||
MT47H128M8SH-25E:M | MICRON/美光 | FBGA60 | 20+ | 34 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MT41K512M16HA-125 IT:A | MICRON/美光 | BGA153 | 19+ | 94 | 2025-05-27 | |||
MT46V32M16P-5B:J | MICRON/美光 | TSOP66 | 1720+ | 74 | 2025-05-27 | |||
MT48LC16M16A2P-7E:G | MICRON/美光 | TSOP54 | 1836+ | 44 | 2025-05-27 | |||
W971GG6KB-25I | WINBOND/华邦 | FBGA84 | 635+ | 47 | 2025-05-27 | |||
MT47H32M16NF-25E:H | MICRON/美光 | FBGA84 | 19+ | 81 | 2025-05-27 | |||
MT41K256M16HA-125:E | MICRON/美光 | BGA96 | 1714+ | 82 | 2025-05-27 | |||
MT41J64M16JT-125:G | MICRON/美光 | BGA96 | 14+ | 100 | 2025-05-27 | |||
MT47H64M16NF-25E IT:M | MICRON/美光 | BGA84 | 18+ | 1267 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K9GAG08U0E-SCB0 |
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SAMSUNG/三星 | TSOP48 | 12+ | 5000 | 2025-05-27 | ||
K9GAG08U0E-SCB0 |
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SAMSUNG/三星 | TSOP48 | 116+ | 1075 | 2025-05-27 | ||
MT48LC32M16A2TG-75IT:C | MICRON/美光 | TSOP54 | 1208+ | 100 | 2025-05-27 | |||
MT46H32M16LFBF-6IT:C | MICRON/美光 | BGA | 13+ | 1 | 2025-05-27 | |||
NAND08GW3B2CN6E | ST/意法 | TSOP48 | 921+ | 116 | 2025-05-27 | |||
MT47H128M16RT-25EIT:C | MICRON/美光 | FBGA84 | 19+ | 242 | 2025-05-27 | |||
S29JL064H70TFI000 | SPANSION/飞索半导体 | TSOP48 | 805+ | 1 | 2025-05-27 | |||
MT47H32M16NF-25EIT:H | MICRON/美光 | BGA84 | 20+ | 145 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
HY57V281620ETP-HI | SKHYNIX/海力士 | TSOP54 | 0839+ | 76 | 2025-05-27 | |||
HY57V641620ETP-H | SKHYNIX/海力士 | TSOP54 | 809+ | 7 | 2025-05-27 | |||
HY57V561620FTP-HI | SKHYNIX/海力士 | TSOP54 | 113+ | 24 | 2025-05-27 | |||
HY57V641620ETP-7 | SKHYNIX/海力士 | TSOP54 | 831+ | 149 | 2025-05-27 | |||
HY57V281620ETP-6 | SKHYNIX/海力士 | TSOP54 | 743 | 83 | 2025-05-27 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
TC58NVG0S3ETA00 | TOSHIBA/东芝 | TSOP48 | 1620+ | 37 | 2025-05-27 | |||
W9825G6EH-6 | WINBOND/华邦 | TSOP54 | 1016+ | 2 | 2025-05-27 | |||
W971GG6JB-25 |
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WINBOND/华邦 | FBGA84 | 413+ | 229 | 2025-05-27 |